JPS5516540B2 - - Google Patents
Info
- Publication number
- JPS5516540B2 JPS5516540B2 JP5437277A JP5437277A JPS5516540B2 JP S5516540 B2 JPS5516540 B2 JP S5516540B2 JP 5437277 A JP5437277 A JP 5437277A JP 5437277 A JP5437277 A JP 5437277A JP S5516540 B2 JPS5516540 B2 JP S5516540B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Thyristors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5437277A JPS52141576A (en) | 1977-05-13 | 1977-05-13 | Semiconductor device having surge absorber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5437277A JPS52141576A (en) | 1977-05-13 | 1977-05-13 | Semiconductor device having surge absorber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52141576A JPS52141576A (en) | 1977-11-25 |
| JPS5516540B2 true JPS5516540B2 (en]) | 1980-05-02 |
Family
ID=12968830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5437277A Granted JPS52141576A (en) | 1977-05-13 | 1977-05-13 | Semiconductor device having surge absorber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52141576A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0335559U (en]) * | 1989-08-19 | 1991-04-08 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016219715A (ja) * | 2015-05-26 | 2016-12-22 | 住友ベークライト株式会社 | 絶縁ゲートバイポーラトランジスタ素子、樹脂組成物およびサージ対策部材 |
-
1977
- 1977-05-13 JP JP5437277A patent/JPS52141576A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0335559U (en]) * | 1989-08-19 | 1991-04-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52141576A (en) | 1977-11-25 |